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| d a t a sh eet product speci?cation 2002 may 16 integrated circuits UBA2014 600 v driver ic for hf fluorescent lamps
2002 may 16 2 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 features adjustable preheat time adjustable preheat current current controlled operating single ignition attempt adaptive non-overlap time control integrated high-voltage level-shift function power-down function protection against lamp failures or lamp removal capacitive mode protection. applications the circuit topology enables a broad range of ballast applications at different mains voltages for driving lamp types from e.g. t8, t5, plc, t10, t12, pll and plt. general description the ic is a monolithic integrated circuit for driving electronically ballasted fluorescent lamps, with mains voltages up to 277 v (rms) (nominal value). the circuit is made in a 650 v bcd power-logic process. it provides the drive function for the 2 discrete power mosfets. beside the drive function the ic also includes the level-shift circuit, the oscillator function, a lamp voltage monitor, a current control function, a timer function and protections. ordering information type number package name description version UBA2014t so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 UBA2014p dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-1 2002 may 16 3 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 quick reference data all voltages are referenced to gnd; v dd = 13 v; v fvdd - v sh = 13 v; t amb =25 c; unless otherwise speci?ed; see chapter application information. symbol parameter conditions min. typ. max. unit high-voltage supply v hs high side supply voltage i hs <30 m a; t < 1 s -- 600 v start-up state v dd(start) oscillator start voltage 12.4 13.0 13.6 v v dd(stop) oscillator stop voltage - 9.1 - v i dd(start) start-up current v dd 2002 may 16 5 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 pinning symbol pin description ct 1 preheat timer output csw 2 voltage controlled oscillator input cf 3 oscillator output iref 4 internal reference current input gnd 5 ground gl 6 gate output for the low-side switch v dd 7 low-voltage supply pcs 8 preheat current sensor input f vdd 9 ?oating supply, supply for the high-side switch gh 10 gate output for the high-side switch sh 11 source of the high-side switch acm 12 capacitive mode input lvs 13 lamp voltage sensor input v ref 14 reference voltage output cs+ 15 positive input for the average current sensor cs - 16 negative input for the average current sensor handbook, halfpage UBA2014p mgw580 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ct csw cf iref gnd gl v dd pcs f vdd gh sh acm lvs v ref cs + cs - fig.2 pin configuration (dip16). handbook, halfpage UBA2014t mgw581 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ct csw cf iref gnd gl v dd pcs f vdd gh sh acm lvs v ref cs + cs - fig.3 pin configuration (so16). 2002 may 16 6 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 functional description start-up state initial start-up can be achieved by charging the low voltage supply capacitor c7 (see fig.8) via an external start-up resistor. start-up of the circuit is achieved under the condition that both half-bridge transistors tr1 and tr2 are non-conductive. the circuit will be reset in the start-up state. if the low voltage supply (v dd ) reaches the value of v dd(h) the circuit will start oscillating. a dc reset circuit is incorporated in the high-side (hs) driver. below the lock-out voltage at the f vdd pin the output voltage (v gh - v sh ) is zero. the voltages at pins cf and ct are zero during the start-up state. oscillation the internal oscillator is a voltage-controlled oscillator circuit (vco) which generates a sawtooth waveform between the cf high level and 0 v. the frequency of the sawtooth is determined by capacitor c cf , resistor r iref , and the voltage at pin csw. the minimum and maximum switching frequencies are determined by r iref and c cf ; their ratio is internally fixed. the sawtooth frequency is twice the half-bridge frequency. the UBA2014 brings the transistors tr1 and tr2 into conduction alternately with a duty cycle of approximately 50%. an overview of the oscillator signal and driver signals is illustrated in fig.4. the oscillator starts oscillating at f max . during the first switching cycle the low-side (ls) transistor is switched on. the first conducting time is made extra long to enable the bootstrap capacitor to charge. adaptive non-overlap the non-overlap time is realized with an adaptive non-overlap circuit (ant). by using an adaptive non-overlap circuit, the application can determine the duration of the non-overlap time and make it optimum for each frequency (see fig.4). the non-overlap time is determined by the slope of the half-bridge voltage, and is detected by the signal across resistor r16 which is connected directly to pin acm. the minimum non-overlap time is internally fixed. the maximum non-overlap time is internally fixed at approximately 25% of the bridge period time. an internal filter of 30 ns is included at the acm pin to increase the noise immunity. timing circuit a timing circuit is included to determine the preheat time and the ignition time. the circuit consists of a clock generator and a counter. the preheat time is defined by c ct and r iref and consists of 7 pulses at c ct ; the maximum ignition time is 1 pulse at c ct . the timing circuit starts operating after the start-up state, as soon as the low supply voltage (v dd ) has reached v dd(h) or when a critical value of the lamp voltage (v lamp(fail) ) is exceeded. when the timer is not operating c ct is discharged to 0 v at 1 ma. preheat state after starting at f max , the frequency decreases until the momentary value of the voltage across sense resistor r14 reaches the internally fixed preheat voltage level (pin pcs). at crossing the preheat voltage level, the output current of the preheat current sensor circuit (pcs) discharges the capacitor c csw , thus raising the frequency. the preheat time begins at the moment that the circuit starts oscillating. during the preheat time the average current sensor circuit (acs) is disabled. an internal filter of 30 ns is included at pin pcs to increase the noise immunity. ignition state after the preheat time the ignition state is entered and the frequency will sweep down due to charging of the capacitor at pin csw with an internally fixed current; see fig.5. during this continuous decrease in frequency, the circuit approaches the resonant frequency of the load. this will cause a high voltage across the load, which normally ignites the lamp. the ignition voltage of a lamp is designed above the v lamp(fail) level. if the lamp voltage exceeds the v lamp(fail) level the ignition timer is started. burn state if the lamp voltage does not exceed the v lamp(max) level the voltage at pin csw will continue to increase until the clamp level at pin csw is reached; see fig.5. as a consequence the frequency will decrease until the minimum frequency is reached. when the frequency reaches its minimum level it is assumed that the lamp has ignited and the circuit enters the burn state. the average current sensor circuit (acs) will be enabled. as soon as the averaged voltage across sense resistor r14, measured at pin cs - , reaches the reference level at pin cs+, the average current sensor circuit will take over the control of the lamp current. the average current through r14 is transferred to a voltage at the voltage controlled oscillator and regulates the frequency and, as a result, the lamp current. 2002 may 16 7 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 lamp failure mode d uring ignition state if the lamp does not ignite, the voltage level increases. when the lamp voltage exceeds the v lamp(max) level, the voltage will be regulated at the v lamp(max) level; see fig.6. at crossing the v lamp(fail) level the ignition timer was already started. if the voltage at pin lvs is above the v lamp(fail) level at the end of the ignition time the circuit stops oscillating and is forced in a power-down mode. the circuit will be reset only when the supply voltage is powered-down. d uring burn state if the lamp fails during normal operation, the voltage across the lamp will increase and the lamp voltage will exceed the v lamp(fail) level; see fig.7. at that moment the ignition timer is started. if the lamp voltage increases further it will reach the v lamp(max) level. this forces the circuit to re-enter the ignition state and results in an attempt to re-ignite the lamp. if during restart the lamp still fails, the voltage remains high until the end of the ignition time. at the end of the ignition time the circuit stops oscillating and the circuit will enter in the power-down mode. power-down state the power-down state will be entered if, at the end of the ignition time, the voltage at pin lvs is above v lamp(fail) . in the power-down mode the oscillator will be stopped and both tr1 and tr2 will be non-conductive. the v dd supply is internally clamped. the circuit is released from the power-down state by lowering the low voltage supply below v dd(reset) . capacitive mode protection the signal across r16 also gives information about the switching behaviour of the half bridge. if, after the preheat state, the voltage across the acm resistor (r16) does not exceed the v cmd level during the non-overlap time, the capacitive mode detection circuit (cmd) assumes that the circuit is in the capacitive mode of operation. as a consequence the frequency will directly be increased to f max . the frequency behaviour is decoupled from the voltage at pin csw until c csw has been discharged to zero. charge coupling due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with a repetitive charge injection. given the typical application the pins iref and cf are sensitive to this charge injection. for charge coupling of 8 pc, a safe functional operation of the ic is guaranteed, independent of the current level. charge coupling at current levels below 50 m a will not interfere with the accuracy of the v cs , v pcs and v acm levels. charge coupling at current levels below 20 m a will not interfere with the accuracy of any parameter. design equations the following design equations are used to calculate the desired preheat time, the maximum ignition time, and the minimum and the maximum switching frequency. t ph = 1.7 10 - 4 c ct r iref (s) t ign = 3.1 10 - 5 c ct r iref (s) in khz f max = 2.5 f min (khz) with c ct in nf, r iref in k w , and c cf in pf. start of ignition is defined as the moment at which the measured lamp voltage crosses the v lamp(fail) level; see section lamp failure mode. f min 125 10 3 c cf r iref () ------------------------------------- = 2002 may 16 8 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 handbook, full pagewidth mgw582 v cf v gl v (gh-sh) 0 0 0 time 0 0 v acm v hb fig.4 oscillator and driver signals. handbook, full pagewidth mgw583 burn state ignition state preheat state f min detection timer on time off v lamp(fail) v lamp(max) v lamp fig.5 normal ignition behaviour. 2002 may 16 9 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 handbook, full pagewidth mgw584 power-down state preheat state ignition state timer ended timer on time off v lamp(fail) v lamp(max) v lamp fig.6 failure mode during ignition. handbook, full pagewidth mgw585 time timer on off v lamp(fail) v lamp(max) v lamp power-down state burn state ignition state timer ended timer started fig.7 failure mode during burn. 2002 may 16 10 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 limiting values in according with the absolute maximum rating system (iec 60134); voltages with respect to pin gnd. note 1. in accordance with the human body model, i.e. equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor. thermal characteristics quality specification in accordance with snw-fq-611-e . symbol parameter conditions min. max. unit v hs high side supply voltage i hs <30 m a; t < 1 s 600 - v i hs <30 m a 510 - v v dd(max) maximum voltage at pin v dd - 14 v v acm(max) maximum voltage at pin acm - 5+5v v pcs(max) maximum voltage at pin pcs - 5+5v v lvs(max) maximum voltage at pin lvs 0 5 v v cs+(max) maximum voltage at pin cs+ 0 5 v v cs - (max) maximum voltage at pin cs -- 0.3 +5 v v csw(max) maximum voltage at pin csw 0 5 v t amb ambient temperature - 25 +80 c t j junction temperature - 25 +150 c t stg storage temperature - 55 +150 c v esd electrostatic handling voltage note 1 pins f vdd , gh, and sh - 1000 v pins ct, csw, cf, iref, gl, v dd , pcs, cs - , cs+, v ref , lvs, and acm - 2500 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air so16 100 k/w dip16 60 k/w r th(j-pin) thermal resistance from junction to pcb in free air so16 50 k/w dip16 30 k/w 2002 may 16 11 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 characteristics all voltages referenced to gnd; v dd = 13 v; v fvdd - v sh = 13 v; t amb =25 c; unless otherwise speci?ed; see chapter application information. symbol parameter conditions min. typ. max. unit high-voltage supply i leak leakage current on high-voltage pins voltage at pins f vdd , gh and sh = 600 v -- 30 m a start-up state v dd supply voltage for de?ned driver output tr1 = off; tr2 = off -- 6v v dd(start) oscillator start voltage 12.4 13.0 13.6 v v dd(low) oscillator stop voltage 8.6 9.1 9.6 v v dd(hys) start-stop hysteresis 3.5 3.9 4.4 v i dd(start) start-up current v dd 2002 may 16 13 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 note 1. the maximum non-overlap is determined by the level of the cf signal. if this signal exceeds a level of 1.25 v the non-overlap will end, resulting in a maximum non-overlap time of 7.5 m s at a bridge frequency of 40 khz. average current sensor i i(cs) input current v cs =0v -- 1 m a v offset offset voltage v cs+ =v cs - = 0 to 2.5 v - 2 0 +2 mv g m transconductance f = 1 khz 1900 3800 5700 m a/mv i o(csw) output current source and sink; v csw =2v8595105 m a timer i o(ct) preheat timer output current v ct = 2.5 v 5.5 5.9 6.3 m a v ol(ct) low-level preheat timer output voltage - 1.4 - v v oh(ct) high-level preheat timer output voltage - 3.6 - v v hys(ct) preheat timer output hysteresis 2.05 2.20 2.35 v t ph preheat time c ct = 330 nf and r iref =33k w 1.6 1.8 2.0 s t ign ignition time c ct = 330 nf and r iref =33k w - 0.26 - s symbol parameter conditions min. typ. max. unit 2002 may 16 14 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... application information n dbook, full pagewidth mgw586 v ref f vdd z1 12 v gh sh gl pcs 1 7 lvs cs - cs + v dd ct 9 10 11 6 45 3 2 14 8 acm 12 13 16 15 csw cf gnd iref c3 1 nf c19 56 nf c17 6.8 nf c8 330 pf c20 68 nf tld36w c22 8.2 nf c23 100 nf c6 1.2 nf c10 5.6 nf c5 100 nf v dc 400 v UBA2014 high side driver low side driver bootstrap driver control supply preheat timer reference current divider adaptive non-overlap timing and capacitive mode detector preheat current sensor lamp voltage sensor - + + average current sensor voltage controlled oscillator r2 8.2 k w r12 33 k w r5 10 k w r18 180 k w r20 220 k w r4 1 m w d4 byd77d lamp r16 1.5 w r1 1 m w r10 1 m w r3 220 k w r13 150 w d1 byd77d r8 8.2 k w f1 1a r9 47 w l1 1.9 mh tr1 irf820 tr2 irf820 c2 12 nf c14 100 pf c13 220 nf c15 330 nf c7 330 nf r14 1 w c24 100 nf fig.8 test and application circuit. 2002 may 16 15 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 package outlines x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot109-1 97-05-22 99-12-27 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1 2002 may 16 16 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 unit a max. 1 2 b 1 cee m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot38-1 95-01-19 99-12-27 a min. a max. b max. w m e e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050g09 mo-001 sc-503-16 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 16 1 9 8 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) d (1) z dip16: plastic dual in-line package; 16 leads (300 mil); long body sot38-1 2002 may 16 17 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (pre-heating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. 2002 may 16 18 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, hbga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable - 2002 may 16 19 philips semiconductors product speci?cation 600 v driver ic for hf ?uorescent lamps UBA2014 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. ? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613502/01/pp 20 date of release: 2002 may 16 document order number: 9397 750 09094 |
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